EAI SmartSP 2023 was held as an on-site conference in Chicago, US



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Full Program

Thank you for participating
Thank you for participating in EAI SmartSP 2023!
We look forward to meeting you next year
in New Orleans, Louisiana, USA on November 2024.

Get involved in the next edition:
Keynotes light
Prof. Yong Tang
FIEEE, University of Texas at Arlington (UTA), US
Keynotes light
Prof. Yong Tang
University of California, Santa Cruz, USA
EAI Index
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Paper Submission is now open for the SmartSP 2023! Check out the Call for Papers.
SmartSP 2023 supports revolutionary EAI Community Review, find out more here.
Every author receives EAI Index credits – regardless of acceptance. Learn more about EAI’s Recognition Program here.
Get real feedback on your presentation from other registrants via EAI Compass.

Welcome to the EAI Community

Let the EAI Community help you build your career with collaborative research, objective evaluation, and fair recognition:

  • Extra visibility for your paper and fair review  →  Community Review
  • Get credits to receive membership ranks and global recognition  →  EAI Index
  • Real-time evaluation and feedback on your presentation on-site  →  EAI Compass


Proceedings have been published in SpringerLink Digital Library.

Best Paper Award

Congratulations to the winners of the Best Paper Award!

The title of the paper:
ADC-Bank: Detecting Acoustic Out-of-Band Signal Injection on Inertial Sensors

Jianyi Zhang (Beijing Electronic Science and Technology Institute); Yuchen Wang (Academy of Information and Communications Technology (CAICT)); Yazhou Tu (University of Louisiana at Lafayette); Sara Rampazzi (University of Florida); Zhiqiang Lin (Ohio State University); Insup Lee (UPenn); Xiali Hei (University of Louisiana at Lafayette)

About SmartSP 2023

Recent proliferation of the Internet of Things (IoT), edge-fog-cloud computing, and interconnected networks envisions that smart cyber-physical system (CPS), especially smart vehicles (SV), are capable of innovative solutions to change our lifestyles. Unavoidably the potential benefits come along with new challenges and concerns on security and privacy. The First EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles (SmartSP 2023) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in security and privacy issues in this exciting area. SmartSP 2023 seeks original papers focusing on theoretical analysis, vulnerability discovery, novel system architecture construction and design, emerging applications, experimental studies, and social impacts of CPS and SV. Both review/survey papers and technical papers are encouraged. SmartSP 2023 also welcomes short papers that summarize speculative breakthroughs, work-in-progress, industry-featured projects, open problems, new application challenges, visionary ideas, and preliminary studies.


We welcome contributions from the following fields:

  • Accident prevention
  • Adaptive attack mitigation for CPS
  • Analytics for intelligent transportation
  • Authentication and access control for CPS and smart vehicles
  • Availability, recovery, and auditing for CPS and smart vehicles
  • Big data-based solutions for CPS security and privacy issues
  • Blockchain-based security and privacy solutions for CPS applications
  • Cooperative driving and traffic management
  • Data security and privacy for CPS and smart vehicles
  • Driver behavior analysis
  • Electric vehicle charging systems security and privacy
  • Embedded systems security and privacy
  • Intrusion detection for CPS
  • Legacy CPS system protection
  • Malware analysis for CPS and smart vehicles
  • Modeling and analysis of smart CPS
  • Smart contract-based trustable and verifiable computations for CPS applications
  • Smart grid security and privacy
  • Threat modeling
  • Traffic theory, modeling, and simulation
  • Urban transportation system security and privacy
  • V2V, V2I, and V2X: architectures and system design
  • Vehicle information systems
  • Vulnerability analysis for CPS and smart vehicles


All registered papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library.

Proceedings will be submitted for inclusion in leading indexing services, such as Web of Science,
Compendex, Scopus, DBLP, EU Digital Library, IO-Port, MatchSciNet, Inspec and Zentralblatt MATH.

Authors of selected papers will be invited to submit an extended version to:

All accepted authors are eligible to submit an extended version in a fast track of:

Additional publication opportunities:

The Best Paper Award

The Best Paper Award winner will receive 1000 USD, which is sponsored by
the College of Computing, Michigan Technological University.

About EAI

This event is organized by EAI.

EAI – European Alliance for Innovation is a non-profit organization and a professional community established in cooperation with the European Commission to empower the global research and innovation, and to promote cooperation between European and International ICT communities.

EAI’s vision is to foster excellence in research and innovation on the principles of transparency, objectivity, equality, and openness. Our guiding principle is community cooperation to create better research, provide fair recognition of excellence and transform best ideas into commercial value proposition.

EAI‘s mission is to create an environment that rewards excellence transparently, and builds recognition objectively regardless of age, economic status or country of origin, where no membership fees or closed door committees stand in the way of your research career.

Through these shared values, EAI leads the way toward advancing the world of research and innovation, empowering individuals and institutions for the good of society to fully benefit from the digital revolution.

Gallery of EAI SmartSP 2023

Important dates

Main Track

Loading important dates.

Work-in-progress Track

Submission deadline
7 August 2023            15 August 2023
Notification deadline
7 September 2023
Camera-ready deadline
21 September 2023
Start of Conference
12 October 2023
End of Conference
13 October 2023


Poster Track

Submission deadline
20 July 2023
Notification deadline
10 August 2023
Camera-ready deadline
10 September 2023
Start of Conference
12 October 2023
End of Conference
13 October 2023


Demos Track

Submission deadline
20 July 2023       6 August 2023       25 August 2023
Notification deadline
7 September 2023
Camera-ready deadline
21 September 2023
Start of Conference
12 October 2023
End of Conference
13 October 2023


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