in New Orleans, Louisiana, USA on November 2024.
Get involved in the next edition:
Paper Submission is now open for the SmartSP 2023! Check out the Call for Papers.SmartSP 2023 supports revolutionary EAI Community Review, find out more here.Every author receives EAI Index credits – regardless of acceptance. Learn more about EAI’s Recognition Program here.Get real feedback on your presentation from other registrants via EAI Compass.
Let the EAI Community help you build your career with collaborative research, objective evaluation, and fair recognition:
Congratulations to the winners of the Best Paper Award!
The title of the paper:
ADC-Bank: Detecting Acoustic Out-of-Band Signal Injection on Inertial Sensors
Jianyi Zhang (Beijing Electronic Science and Technology Institute); Yuchen Wang (Academy of Information and Communications Technology (CAICT)); Yazhou Tu (University of Louisiana at Lafayette); Sara Rampazzi (University of Florida); Zhiqiang Lin (Ohio State University); Insup Lee (UPenn); Xiali Hei (University of Louisiana at Lafayette)
Recent proliferation of the Internet of Things (IoT), edge-fog-cloud computing, and interconnected networks envisions that smart cyber-physical system (CPS), especially smart vehicles (SV), are capable of innovative solutions to change our lifestyles. Unavoidably the potential beneﬁts come along with new challenges and concerns on security and privacy. The First EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles (SmartSP 2023) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in security and privacy issues in this exciting area. SmartSP 2023 seeks original papers focusing on theoretical analysis, vulnerability discovery, novel system architecture construction and design, emerging applications, experimental studies, and social impacts of CPS and SV. Both review/survey papers and technical papers are encouraged. SmartSP 2023 also welcomes short papers that summarize speculative breakthroughs, work-in-progress, industry-featured projects, open problems, new application challenges, visionary ideas, and preliminary studies.
We welcome contributions from the following fields:
All registered papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library.
Proceedings will be submitted for inclusion in leading indexing services, such as Web of Science,
Compendex, Scopus, DBLP, EU Digital Library, IO-Port, MatchSciNet, Inspec and Zentralblatt MATH.
Authors of selected papers will be invited to submit an extended version to:
All accepted authors are eligible to submit an extended version in a fast track of:
Additional publication opportunities:
The Best Paper Award winner will receive 1000 USD, which is sponsored by
the College of Computing, Michigan Technological University.
This event is organized by EAI.
EAI – European Alliance for Innovation is a non-profit organization and a professional community established in cooperation with the European Commission to empower the global research and innovation, and to promote cooperation between European and International ICT communities.
EAI’s vision is to foster excellence in research and innovation on the principles of transparency, objectivity, equality, and openness. Our guiding principle is community cooperation to create better research, provide fair recognition of excellence and transform best ideas into commercial value proposition.
EAI‘s mission is to create an environment that rewards excellence transparently, and builds recognition objectively regardless of age, economic status or country of origin, where no membership fees or closed door committees stand in the way of your research career.
Through these shared values, EAI leads the way toward advancing the world of research and innovation, empowering individuals and institutions for the good of society to fully benefit from the digital revolution.