3rd EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles
Mary P. Czerwinski
Partner Research Manager at Microsoft
Nicos Maglaveras
Professor at Aristotle University
EAI SmartSP 2025
- 1-2 December, 2025
- Salt Lake City, USA
Recent proliferation of the Internet of Things (IoT), edge-fog-cloud computing, and interconnected networks envisions that smart cyber-physical systems (CPS), especially smart vehicles (SV), are capable of innovative solutions to change our lifestyles.
Unavoidably, the potential benefits come along with new challenges and concerns on security and privacy. The Second EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles (SmartSP 2025) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in security and privacy issues in this exciting area.
EAI SmartSP 2025 seeks original/invited papers focusing on theoretical analysis, vulnerability discovery, novel system architecture construction and design, emerging applications, experimental studies, and social impacts of CPS and SV. Both review/survey papers and technical papers are encouraged. SmartSP 2025 also welcomes short papers that summarize speculative breakthroughs, work-in-progress, industry-featured projects, open problems, new application challenges, visionary ideas, and preliminary studies.
SmartSP conference proceedings received
Conference proceedings
All registered papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library: SmartSP Conference Proceedings.
Authors of selected best accepted and presented papers will be invited to submit an extended version to:
All accepted authors are eligible to submit an extended version in a fast track of:
Authors have the opportunity to publish their articles in the EAI Endorsed Transactions journal selected by the conference (Scopus, Ei-indexed, ESCI-WoS, Compendex) by paying an additional $250, discounted from the standard $400 rate for conference authors.
The article’s publication is subject to the following requirements:
- It must be an extended version of the conference paper with a different title and abstract. In general, 30% of new content must be added.
- The article will be processed once the conference proceedings have been published.
- The article will be processed using the fast-track option.
- Once the conference proceedings are published, the corresponding author should contact us at [email protected] with the details of their article to begin processing.
Additional publication opportunities:
- EAI Transactions series (Open Access)
- EAI/Springer Innovations in Communications and Computing Book Series
(titles in this series are indexed in Ei Compendex, Web of Science & Scopus)
EAI is an open community dedicated to creating an environment where every member receives the same opportunities, benefits and opportunities to develop and grow their research mission and career. As the largest free professional research society in the world EAI offers a complete range of conference proceedings publication opportunities. Based on the qualification of the conference and the conference scope EAI provides the possibility to publish the proceedings for every sponsored conference. Consistent with its mission to support developing communities all EAI sponsored conferences appear in EUDL, the European Union Digital Library (EUDL). EUDL is Open Access and free for EAI members reaching a community of 250,000 subscribers and providing the visibility that allows the conference organizers to develop the conference into a fully fledged indexed proceedings publication in subsequent years.
SmartSP 2025 Deadlines
Notification deadline
- 13 September 2025
Camera-ready deadline
- 3 October 2025
Notification deadline
- 1st August 2024
Camera-ready deadline
- 20th August 2024
Notification deadline
- 1st August 2024
Camera-ready deadline
- 20th August 2024
3rd EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles
Why Attend?
The third EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles (SmartSP 2025) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in security and privacy issues in this exciting area.
- Accepted Papers from 15+ Countries
- Workshop- IOT in Health Research
- Exciting Social Program
- Insightful Posters Session
Location
Salt Lake City, the capital of Utah, is a picturesque city nestled between the Wasatch Mountains and the Great Salt Lake. The city is a gateway to outdoor adventures, offering world-class skiing, hiking, and access to nearby national parks. With a thriving arts scene, vibrant downtown, and a growing tech industry, Salt Lake City blends natural beauty, cultural heritage, and modern development into a unique and welcoming destination.
EAI SmartSP 2025 will take place
From 1-2 December 2025 in Salt Lake City, USA.
“SmartSP 2024 concluded successfully in New Orleans, Louisiana, on November 7-8, 2024. The edition centered on cutting-edge security and privacy research within cyber-physical systems and smart vehicles. The program included three distinguished keynote speakers – Professor Kevin Butler (University of Florida), Professor Daphne Yao (Virginia Tech), and Dr. Kenneth Rohde (Idaho National Laboratory) – alongside one invited talk, 17 technical paper presentations, and two engaging demo presentations. We are grateful for the support of our sponsors, which enabled us to provide travel grants to eight students. SmartSP 2024 saw significant growth, with a 50% increase in both paper submissions and participant attendance compared to the previous year. Notably, an accepted paper was authored by a student from a U.S. high school. As a participant, I found the conference to be exceptionally valuable and believe SmartSP provides an excellent platform for disseminating research in cyber-physical systems and smart vehicle security.“
Prof. Bo Chen
Michigan Technological University, USA
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