3rd EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles

Mary P. Czerwinski

Partner Research Manager at Microsoft

Nicos Maglaveras

Professor at Aristotle University

3rd EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles

Why Attend?

The third EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles (SmartSP 2025) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in security and privacy issues in this exciting area.

Location

Explore Salt Lake City

Salt Lake City, the capital of Utah, is a picturesque city nestled between the Wasatch Mountains and the Great Salt Lake.  The city is a gateway to outdoor adventures, offering world-class skiing, hiking, and access to nearby national parks. With a thriving arts scene, vibrant downtown, and a growing tech industry, Salt Lake City blends natural beauty, cultural heritage, and modern development into a unique and welcoming destination.

EAI SmartSP 2025

Recent proliferation of the Internet of Things (IoT), edge-fog-cloud computing, and interconnected networks envisions that smart cyber-physical systems (CPS), especially smart vehicles (SV), are capable of innovative solutions to change our lifestyles.

Unavoidably, the potential benefits come along with new challenges and concerns on security and privacy. The Second EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles (SmartSP 2025) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in security and privacy issues in this exciting area.

EAI SmartSP 2025 seeks original/invited papers focusing on theoretical analysis, vulnerability discovery, novel system architecture construction and design, emerging applications, experimental studies, and social impacts of CPS and SV. Both review/survey papers and technical papers are encouraged. SmartSP 2025 also welcomes short papers that summarize speculative breakthroughs, work-in-progress, industry-featured projects, open problems, new application challenges, visionary ideas, and preliminary studies.

SmartSP conference proceedings received
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Conference proceedings
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Publication
All registered papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library. Authors of selected best accepted and presented papers will be invited to submit an extended version to:   By paying an additional $150, authors can publish their articles in the EAI Endorsed Transactions journal selected by the conference (Scopus and Ei-indexed). The article’s publication is subject to the following requirements: – It must be an extended version of the conference paper with a different title and abstract. In general, 30% of new content must be added. – The article will be processed once the conference proceedings have been published. – The article will be processed using the fast-track option. – Once the conference proceedings are published, the corresponding author should contact us at [email protected] with the details of their article to begin processing. Additional publication opportunities:
SmartSP 2025 Deadlines
Important dates

Full Paper Submission deadline

Poster/Demo Submission deadline

Notification deadline

Camera-ready deadline

Poster Track

Full Paper Submission deadline

Notification deadline

Camera-ready deadline

Late Track

Full Paper Submission deadline

Notification deadline

Camera-ready deadline

EAI SmartSP 2025 will take place

From 1-2 December 2025 in Salt Lake City, USA.

SmartSP 2024 concluded successfully in New Orleans, Louisiana, on November 7-8, 2024. The edition centered on cutting-edge security and privacy research within cyber-physical systems and smart vehicles. The program included three distinguished keynote speakers – Professor Kevin Butler (University of Florida), Professor Daphne Yao (Virginia Tech), and Dr. Kenneth Rohde (Idaho National Laboratory) – alongside one invited talk, 17 technical paper presentations, and two engaging demo presentations. We are grateful for the support of our sponsors, which enabled us to provide travel grants to eight students. SmartSP 2024 saw significant growth, with a 50% increase in both paper submissions and participant attendance compared to the previous year. Notably, an accepted paper was authored by a student from a U.S. high school. As a participant, I found the conference to be exceptionally valuable and believe SmartSP provides an excellent platform for disseminating research in cyber-physical systems and smart vehicle security.

Prof. Bo Chen

Michigan Technological University, USA

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